KU-BAND TRANSITION WITH NOT METALIZED AIR-VIAS BETWEEN MICROSTRIP LINE AND SUBSTRATE INTEGRATED WAVEGUIDE

Authors

  • Farouk Grine
  • Mohamed Taoufik Benhabiles
  • Mohamed Lahdi Riabi

DOI:

https://doi.org/10.1590/2179-10742017v16i1778

Keywords:

Substrate Integrated Waveguide, Microstrip Line, Tapred Transition, Air-Vias

Abstract

In this letter, a new transition between microstrip line and substrate integrated waveguide in Ku-band frequency is proposed. This transition composed of one row of not metallized air-vias drilled on both sides of the microstrip line with taper end. The electromagnetic analysis is carried out using a commercial software tool. The presented transition achieves return losses better than 41 dB in Ku-band frequency (12.4-18GHz). In order to validate the simulated results of the proposed concept, a back-to-back transition prototype is designed, fabricated and measured. The measured results demonstrate a minimum return loss of 29.05 dB and maximum insertion loss of 0.685 dB over the entire Ku-band frequency.

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Published

2017-08-01

How to Cite

Farouk Grine, Mohamed Taoufik Benhabiles, & Mohamed Lahdi Riabi. (2017). KU-BAND TRANSITION WITH NOT METALIZED AIR-VIAS BETWEEN MICROSTRIP LINE AND SUBSTRATE INTEGRATED WAVEGUIDE. Journal of Microwaves, Optoelectronics and Electromagnetic Applications (JMOe), 16(1), 50–58. https://doi.org/10.1590/2179-10742017v16i1778

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Regular Papers

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