KU-BAND TRANSITION WITH NOT METALIZED AIR-VIAS BETWEEN MICROSTRIP LINE AND SUBSTRATE INTEGRATED WAVEGUIDE
Keywords:Substrate Integrated Waveguide, Microstrip Line, Tapred Transition, Air-Vias
In this letter, a new transition between microstrip line and substrate integrated waveguide in Ku-band frequency is proposed. This transition composed of one row of not metallized air-vias drilled on both sides of the microstrip line with taper end. The electromagnetic analysis is carried out using a commercial software tool. The presented transition achieves return losses better than 41 dB in Ku-band frequency (12.4-18GHz). In order to validate the simulated results of the proposed concept, a back-to-back transition prototype is designed, fabricated and measured. The measured results demonstrate a minimum return loss of 29.05 dB and maximum insertion loss of 0.685 dB over the entire Ku-band frequency.
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